Power Consumption Test
System Wait Time - 49W


OCCT - 100W
Intel Burn Test v2.4, Stress Level Maximum


To compare power consumption before and after overclocking, the CPU at standby was 11W, and only 73W at full-speed operation.
Hopefully, we can soon see Intel able to use 32nm CPUs in its 4 cores so a lower temperature,
lower power consuming CPU will become common in the market.


ECS H55H-I
Strengths
1. The color of the external packaging gives a good feel to the product.
2. ITX motherboards rarely have many so BIOS options. The voltage range is large, and the external viewing and adjustment option are numerous.
3. With the internal IGP, the CPU can overclock to 180MHz, which is higher than many ATX or M-ATX H55s.
4. The overall performance of the ITX platform can be increased using the H55 chipset with newer CPU support.

5. Price is around US$80. With ITX motherboards usually being more on the expensive side, the C/P’s pricing is reasonable.

Disadvantages
1. The outer appearance would have a better feel if the PCB was black.
2. Changing to all solid state capacitors would make consumers have more faith in the quality of the product.
3.CPU-Z and EVEREST are still unable to acquire the proper CPU voltage for the H55H-I



Performance ★★★★★★★★★☆
Components ★★★★★★★☆☆☆
Specs ★★★★★★★★☆☆
Appearance ★★★★★★★★☆☆
Price ★★★★★★★★★☆

In terms of CPUs, the Intel Pentium G6950 follows the Core i7 high-level framework, even though it only has Dual Core and L3 3MB specs.
Its performance is not inferior to Core 2 Duo CPUs.
The 32nm CPU allows for a wider overclocking range, and also effectively reduces temperature and power consumption.
Even more importantly, the 32nm CPU enjoys higher performance and better C/P values when coupled with an IGP platform,.
The Core i5 level 32nm is currently priced a bit higher.
If the price is lowered in the future, consumers will be able purchase high-performance HTPC platforms more easily.

As a result of the release of the H55 chipset, which replaced previous generation Intel G4X chipset products,
early this year, the overall 3D performance of PC platforms was increased.
In the current market, the H55 is a very popular among products with M-ATX specs.
Motherboard manufacturers are now successively releasing various models of H55 motherboard products.
In the past, rudimentary versions of the ITX motherboards were about TWD4500 (US$143) or more, which is quite expensive.
Industrial ACP-level ITX motherboards mainly use high-quality components, and if coupled with a GM45 chipset, cost US$300 or more.
ITX products are generally more expensive than ATX/M-ATX products and seem to be on the path to even higher prices.

The ECS H55H-I follows the trends of the average consumer market,
so when the mini-ITX spec H55 motherboard was released, it is more favorable in terms of pricing.
Due to its adoption of Intel’s newest IGP chipset, the commonly-seen BIOS overclocking options won’t lose out to other large-size H55 motherboards.
If ECS were able to further improve the components it uses,
I believe it could provide consumers with an additional option for affordable, high-performance motherboard products. 